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Analysis Software(Steel) - List of Manufacturers, Suppliers, Companies and Products

Analysis Software Product List

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DapTechnology's Fire Diagnostic Suite

DapTechnology's Fire Diagnostic Suite

The FireDiagnostics suite is analyzer software used in combination with the FireSpy analyzer.

The FireDiagnostics Suite is software used in conjunction with Dap Technology's FireSpy. This software integrates 1394 analysis, simulation, and interface tools for a wide range of applications. In addition to hardware-assisted analyzer tools such as monitors, recorders, generators, commanders, scriptwriters, and Mil1394 signal monitors, this suite also provides a set of software tools designed to integrate FireSpy products into various test applications. The FireDiagnostics Suite is created through an application programming interface (API), and applications for the FireSpy analyzer equipped with interfaces for development environments such as C/C++ and LabVIEW TM on Microsoft Windows OS are highly flexible. By using the API library, you can control all hardware-assisted analyzer tools such as recorders and generators, as well as lower-level 1394 bus functions.

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Sheet forming analysis software 'eta/DYNAFORM'

Sheet forming analysis software 'eta/DYNAFORM'

A smart choice for reducing lead times, cutting costs, and improving quality in press part mold design!

"eta/DYNAFORM" is a specialized analysis software for sheet metal forming developed with the aim of reducing the number of trial and error iterations in mold modifications. It consists of a standard package called "Basic," along with paid options such as "D-Eval," "BSE," and "Blank/Trim Line Development." It enables high-precision formability evaluation and springback prediction for parts ranging from automotive components to precision equipment. Please feel free to contact us if you need assistance. 【Features】 ■Basic (Standard Package) - Conducts analysis using molds and blanks, similar to actual machines. - Can also be used as a tool for accumulating in-house mold technology know-how and for sales purposes. ■BSE (Blank Size Engineering: Blank Prediction Function) - Analysis can be performed using only part shapes or mold shapes. - Equipped with a proprietary solver "MSTEP," it can quickly generate effective reference data for part and mold design. *For more details, please refer to the PDF materials or feel free to contact us.

  • Mold Design
  • Other analyses

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Strength analysis software for printed circuit boards 'FEMFAT MELCOM'

Strength analysis software for printed circuit boards 'FEMFAT MELCOM'

Simulating to predict defects on printed circuit boards used in power electronics products.

"FEMFAT MELCOM" is a software package developed by Magna Powertrain Engineering Center Steyr (ECS) to predict defects on printed circuit boards (PCBs) incorporated in power electronics products such as inverters through simulation. 【Features】 ■ Predicts cracks in solder joints on printed circuit board assemblies (PCBAs) due to vibrations in power electronics products. ■ Predicts flex cracks in multilayer ceramic capacitors (MLCCs) during the process of attaching PCBAs to power modules. ■ Predicts cracks due to thermal fatigue in response to temperature loads on PCBAs. *For more details, please download the PDF or contact us.

  • FF-MELCOM_TopPicture.jpg
  • Structural Analysis

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